10 Apr 2003, 11:15, mark lewis (1:3634/12), wrote to Charles Angelich:

Hi mark.

 CA>> Apparently a bad contact with the memory stick but while I was
 CA>> there I decided to 'dust' the CPU heatsink and discovered
 CA>> there is no paste between the heatsink and CPU - not good.

 ml> be careful, there... some CPUs are designed to be seated with 
 ml> their heatsinks without any heatsink compound... adding compound 
 ml> can (and has) caused problems by insulating the chip too much 
 ml> from the heatsink... not knowing what you've got, its hard to say 
 ml> more...

Odd.  All Intel CPUs of the Pentium class and above are shipped with
heatsink compound, as well as instructions on its application.  AMD and the
former Cyrix will void your warranty if there is evidence of a bubble in
the heatsink compound between the CPU and heatsink.  Both issue pretty
clear instructions on how to apply the compound, and what brands are
recommended.  Prior to the 486, this proceedure was a bit 'iffy'.

Aside from that, only the P-III has a _flat_ surface, but the surface area
is so small relative to the watts/sq in. needed for heat dissipation, it
would require a hand lapped heatsink, and those just don't exist.


     Good luck...  M.

--- Msged/386 TE 06 (pre)