12 Apr 2003, 23:00, mark lewis (1:3634/12), wrote to Roy J. Tellason:

Hi mark.

 ml> wait till you get one where the heatsink has four circular 
 ml> foamrubber feet in each corner... this is one that goes on the 
 ml> early duron or so... on the chip, the actual die is raised and is 
 ml> about the size of your little fingernail... that's all the area 
 ml> that the heatsink is to touch, too... and there're surface mount 

That description of the die size and the raised area sounds very similar to
that of the Intel P-III.  Pretty useless amount of area for conducting
heat.  Intel shipped the P-IIIs with heatsink/fan combos that had a wad of
what I like to call 'pink bubble gum' stuck on for the thermal contact
area.

 ml> chips on the ceramic... too much heatsink or getting sloppy can 
 ml> cause a short on the cpu, itself...

I didn't know anyone made an electrically conductive thermal compound. 
None that I've ever used were electrically conductive.


     Good luck...  M.

--- Msged/386 TE 06 (pre)