Hello Tom,

  TW> In fact last I heard IBM was producing a dye with 4
    > CPU's on the same chip.

Was this an implementation of POWER, PowerPC or something else?  Years ago
I remember talk about "waferscale": putting a whole bunch of
microprocessors on the same wafer, but then leaving the wafer intact
(routing around defective ones automatically).

  TW> And the latest and fastest super computers use
    > Hundreds of Parallel CPU's

Right, now imagine that on one die, and then imagine how much computing
power you could get from a machine with multiple dies.  I'm sure that an
intact die represents a significant packaging challenge though.

- Andy Ball

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