JP> Disturbing the dialectric used to give a better BTU
 JP> transfer from the CPU to the radiator, is not a good
 JP> thing unless one has some of that goo to replace on
 JP> the CPU.

/IF/ there is any heatsink compound used at all... some devices are
documented specifically to _not_ use any heatsink compund but directly
transfer the heat to the radiator via bare metal to bare metal... several
AMD chips are in this category...

and then there's also the use of the heatsink pad instead of the
"goo"... the pads are more uniform in size, shape and thickness
and provide better transfer than goo that relies on the gap and pressure to
spread out and hopefully be uniform in thickness...

)\/(ark