ML>  JP> Disturbing the dialectric used to give a better BTU
ML>  JP> transfer from the CPU to the radiator, is not a good
ML>  JP> thing unless one has some of that goo to replace on
ML>  JP> the CPU.

ML> /IF/ there is any heatsink compound used at all... some devices are
documented
ML> specifically to _not_ use any heatsink compund but directly transfer the
heat
ML> to the radiator via bare metal to bare metal... several AMD chips are in
this
ML> category...

ML> and then there's also the use of the heatsink pad instead of the
"goo"...
the
ML> pads are more uniform in size, shape and thickness and provide better
transfer
ML> than goo that relies on the gap and pressure to spread out and hopefully be
ML> uniform in thickness...

I got a new heatsink with one of those pads - it was a disaster.
The CPU kept yelling that it was cooking, and shutting down.

Once I completely removed the pad and replace it with a dab of 
thermal goo, the heat sink finally was able to soak up the heat 
and chip temperature stayed safely within spec.




Terry V.
---
 þ MM 1.1 þ "Blessed are the censors, for they shall inhibit the earth."


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