TW> -> and then there's also the use of the heatsink pad instead of the
"goo"...
TW> the
TW> -> pads are more uniform in size, shape and thickness and provide better
TW> transfer
TW> -> than goo that relies on the gap and pressure to spread out and hopefully
be
TW> -> uniform in thickness...

TW>  It just takes practice. But becasue the Heat Sink compound has a higher
TW> heat conductivity index then the Padt it is far perferable. BUT it is
TW> harder to correctly install. Both too muxh and too little can cause
TW> problems.

Air bubbles in the goo can also cause problems.

Best method is to assemble the sink to the chip at a slight angle, 
then press them together like closing a book.
Any air between them gets squeezed out to the side, and you get solid 
goo-metal contact all over the relatively tiny hot area.




Terry V.
---
 þ MM 1.1 þ "I...did vote for the $87 billion before I voted against it"


--- QScan/PCB v1.20a / 01-0462