Hello, Mark, I am back in TI ! 

 ML> and then there's also the use of the heatsink pad instead of the
 ML> "goo"... the pads are more uniform in size, shape and thickness and
 ML> provide better transfer than goo that relies on the gap and pressure to
 ML> spread out and hopefully be uniform in thickness...

        Yeeks !  Goo is goo. When I got this new system from JimH of
  O'do, now of Georgia, he mentioned that there was a "pad" of
  compound on the heat sink that would melt and fuse the two of them
  and that it was a " one use " compound. I had to remove the radiator
  and then I remembered that I had defeated its purpose.

        I should have noted the temperature of CPU before I applied
  the new goo, but did not. I had the system open to extract the USB
  2.0 card and abused the occasion to apply the goo. Better with than
  without is my motto. Now it runs at +/- 45 C on that system when
  another system, an 800 GHz, runs at +/- 25 C, the first one being an
  Athlon 1.2 GHz. Should this make the difference ?

        Even thickness is a dream. No way to guage it. Spread it and
  take your chances. I removed the first application as it was too
  liquid. I then neaded the tube and that mixed it all and it was
  goohy enough then to keep in place while I assembled the radiator.



 Sig: No new thinkpad yet.
  The old one still working.
 
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