David Wei wrote:

> 
> 
> This kind of packaging is called FCPGA (Flip Chip PGA), or C4 packaging.
> Instead of having using the edge of the chip to connect to the outside
> world, this allows practically ANYWHERE convenient to be wired out
> directly. So they don't have to wire it to the edge of the chip before
> then line can be hooked up. Better signal, and stronger connection. IBM
> claimed that there's never been an failed connection in the field since
> its invention over 20 years ago. In effect, all the connection points
> are on the top side of the chip, so they just flip it over and literally
> solder onto the "carrier". Then inject material like epoxy to seal it
> off to protect the chip and the contact point. As well as providing
> mechanical strength.

I don't think we are talking about the same thing here.  I am talking
about the center on the top of the waffer that makes contact with the
heat sink/fan.  The instructions said to peel off the plastic film on it
if there was one.  I was unsure if mine had the film or not.

Regards,  Jim


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