JH>Hello, Jay.
JH>-=> on 03-22-05 20:53, JAY EMRIE wrote to JIM HOLSONBACK <=-

JH> JE> Jim, I'm no expert is this area, but it seems to me that the adhesive
JH> JE> you talk about would NOT provide the necessary heat conduction between
JH> JE> the CPU and the heat sink - thus likely to damage the CPU.

JH>I think so too.  I was going to put heatsink compound on the die, and
JH>use the adhesive out at the periphery of the chip.

OK, that might work as long as the adhesive does not prevent (not too
thick) the necessary contact between the CPU and the heat sink.

Jay
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 þ OLXWin 1.00a þ I feel young, but my body doesn't agree.