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echo: tech
to: WAYNE CHIRNSIDE
from: JIM HOLSONBACK
date: 2005-03-25 20:04:00
subject: Adhesives for Testing

Hello, Wayne.  Thanks for responding.

-=> on 03-23-05 18:23, WAYNE CHIRNSIDE wrote to JIM HOLSONBACK <=-

 WC> you can do this of course but have you considered the thermal effects
 WC> of the CPU on the adhesive's properties?

Yes, I thought about that before I posted my  question - - that is why
I posted it.  But my idea was a bummer for other reasons - - see my
current response to Matt.
- - -  JimH.
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