Hello, Tom.
-=> on 03-24-05 08:59, TOM WALKER wrote to JIM HOLSONBACK <=-

 JH> JE> Jim, I'm no expert is this area, but it seems to me that the adhesive
 JH> JE> you talk about would NOT provide the necessary heat conduction between
 JH> JE> the CPU and the heat sink - thus likely to damage the CPU.

 JH>I think so too.  I was going to put heatsink compound on the die, and
 JH>use the adhesive out at the periphery of the chip.

 TW>  IF any squeezes out you are using TOO MUCH. The adhesive will do NO
 TW>  good and could prevent the heat sink from properly seating on the CPU
 TW>  causing Hot Spots.

I had no idea of anything squeezing out.  Jean P. made up some kind of a
"dike" statement.  All I was ever talking about was regular application
of heatsink compound between the HS&f and the die on the chip, plus my
idea of some gobs of "adhesive" out around the periphery of the chip to
hold the chip/hs&f combo together while being moved on to another test
momboard.

But I now know my idea isn't going to work for physical reasons.  See my
current post to Matt.
- - -  JimH.







 TW> ---
 TW>  þ SLMR 2.1a þ This note from El Cajon California USA

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