Jello, Tom.
-=> on 03-24-05 09:04, TOM WALKER wrote to JIM HOLSONBACK <=-

 JH>I intend to use heatsink compound on the die, and put the gobs of
 JH>adhesive out around ther edges of the overall chip.

 TW> For what purpose? I fail to see the need at all.

For the purpose I stated in my original posting - -  to be able to
remove a cpu+heatsink and fan combo from a test mainboard and move it
to another mainboard to be tested, without having to rework the cpu to
hs&f thermal compound interface..

But my original idea will not work.  See my current post to Matt.

- - -  JimH.

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