JH>I am about to start into some testing of a number of Athlon type
JH>mainboards.  I have an older Duron 900 or so chip for my test cpu, and a
JH>suitable heatsink/fan combo for that. What I want to avoid is having to
JH>disassemble the cpu/heatsink combo at each testing, and worry about
JH>reapplication of heatsink compound.

JH>I'm thinking about some sort of temporary adhesive between the cpu chip
JH>and the heatsink/fan, so that they can remain together between mainboard
JH>testings.

JH>In recent mailings to me of credit card renewals, the cards are mailed
JH>attached by some sort of a gob of goo adhesive to a stiff paper
JH>substrate. I was thinking that this sort of temporary adhesive might
JH>suit my testing purposes for mating of a test cpu to a test HS&F, for
JH>swapping around.

 DO NOT DO IT.
Those blobs are NOT a heat conductor. While it is a pain using the Heat
Sink compound is by far the best. Carefully cleaning the CPU each time
the heat sink is changed and applying a fresh batch. Being carefull to
not use too much.
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 þ SLMR 2.1a þ This note from El Cajon California USA