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| subject: | Adhesives for Testing |
Hello, Jay. -=> on 03-22-05 20:53, JAY EMRIE wrote to JIM HOLSONBACK <=- JE> Jim, I'm no expert is this area, but it seems to me that the adhesive JE> you talk about would NOT provide the necessary heat conduction between JE> the CPU and the heat sink - thus likely to damage the CPU. I think so too. I was going to put heatsink compound on the die, and use the adhesive out at the periphery of the chip. - - - JimH. ... "A merry heart doeth good like a medicine." - - Proverbs --- MultiMail/MS-DOS v0.46* Origin: Try Our Web Based QWK: DOCSPLACE.ORG (1:123/140) SEEN-BY: 633/267 270 @PATH: 123/140 500 106/2000 633/267 |
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