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echo: tech
to: JAY EMRIE
from: JIM HOLSONBACK
date: 2005-03-23 11:01:00
subject: Adhesives for Testing

Hello, Jay.
-=> on 03-22-05 20:53, JAY EMRIE wrote to JIM HOLSONBACK <=-

 JE> Jim, I'm no expert is this area, but it seems to me that the adhesive
 JE> you talk about would NOT provide the necessary heat conduction between
 JE> the CPU and the heat sink - thus likely to damage the CPU.

I think so too.  I was going to put heatsink compound on the die, and
use the adhesive out at the periphery of the chip.

- - -  JimH.


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