JH> JE> Jim, I'm no expert is this area, but it seems to me that the adhesive
JH> JE> you talk about would NOT provide the necessary heat conduction between
JH> JE> the CPU and the heat sink - thus likely to damage the CPU.

JH>I think so too.  I was going to put heatsink compound on the die, and
JH>use the adhesive out at the periphery of the chip.

 IF any squeezes out you are using TOO MUCH. The adhesive will do NO
 good and could prevent the heat sink from properly seating on the CPU
 causing Hot Spots.
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 þ SLMR 2.1a þ This note from El Cajon California USA