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| subject: | Adhesives for Testing |
Hello Tom !
TW> IF you have any heat sink compound squeezing out you are using TOO
TW> much. NO dike should be needed.
As you say, too much of a good thing does not make it better.
The amount of goo required is minimal as the "acceptor" on the fan
block is flat on the CPU body and tight too.
No thanks to IBM on recovering this Thinkpad.
Thanks to all on the echo.
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