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echo: tech
to: TOM WALKER
from: JEAN PARROT
date: 2005-03-24 16:23:00
subject: Adhesives for Testing

Hello Tom ! 

 TW> IF you have any heat sink compound squeezing out you are using TOO
 TW> much. NO dike should be needed.

        As you say, too much of a good thing does not make it better.
  The amount of goo required is minimal as the "acceptor" on the fan
  block is flat on the CPU body and tight too.


 No thanks to IBM on recovering this Thinkpad.
  Thanks to all on the echo.
 
    
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