Hi, Matt.  Thanks for responding.
-=> on 03-24-05 00:13, MATT MC_CARTHY wrote to JIM HOLSONBACK <=-

 JH> I intend to use heatsink compound on the die, and put the gobs of
 JH> adhesive out around ther edges of the overall chip.

 MM> That would be the only way!  On the P-4s, the heatsink overlaps the CPU
 MM> so much that there is no way to release the CPU socket locking handle
 MM> to remove the CPU/Heatsink as a unit  :-((

Aarrghh!  That is _the_ problem with my idea to make a "portable" combo
of chip and HS&F to move between test mainboards - - with all the HS&f
combos I have here, they are all so wide that the lever to release the
cpu chip from the ZIF socket is covered up.  Maybe I could do some
hacksawing on the heatsink and come up with a "Frankenstein" HS&f combo
which would clear the lever?  I may look at that if I get a bit more
aggravated with the situation of reworking the heatsink compound
interface to the die every time.  But for now, I'm back to a rebuild
each and every time.

 MM> My best guess for making something 'portable' would be to use some of
 MM> that automotive High Temp Silicone around the edge if you can get it to
 MM> set before it drips or runs.  At least it should be able to withstand
 MM> the fin temperatures, and it is pretty easy to cut loose with a razor
 MM> blade when no longer needed.

Yep, that was what I was thinking, but per the above . . .

 MM> A 'thicker wall' of that Silicone would reduce the 'stretch factor'
 MM> when removing and handling the 'assembly' to reduce the chance of
 MM> breaking the actual heat sink compound loose.

No huge loss if I were to burn up my intended Duron 700 test chip, but
per the above, my original idea won't work at all, due to the geometry
of the hs&f's I have here.

Thanks Matt, and to all who have responded on this thread to my original
question.  Sorry I didn't better check out the hs&f geometry problem
before I first posted.

- - -  JimH.



 
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