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| subject: | Adhesives for Testing |
JP> As you say, too much of a good thing does not make it better. JP> The amount of goo required is minimal as the "acceptor" on the fan JP> block is flat on the CPU body and tight too. The thermal goo is really only to fill in the imperfection and scratches o nthe surfaced. Solid contact is the best heat tranmsfer way. The thin film of go ois only to eliminate the smal lAir cavities whics conduct very poorly. I suppose in Theory a Lapped surface is best. But that is not practical on the CPU itslef becuase it is so easy to damage a possabibly expensive CPU.. --- þ SLMR 2.1a þ This note from El Cajon California USA* Origin: Try Our Web Based QWK: DOCSPLACE.ORG (1:123/140) SEEN-BY: 633/267 270 @PATH: 123/140 500 106/2000 633/267 |
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