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echo: tech
to: JEAN PARROT
from: TOM WALKER
date: 2005-03-25 07:05:00
subject: Adhesives for Testing

JP>        As you say, too much of a good thing does not make it better.
JP>  The amount of goo required is minimal as the "acceptor" on the fan
JP>  block is flat on the CPU body and tight too.

 The thermal goo is really only to fill in the imperfection and
 scratches o nthe surfaced. Solid contact is the best heat tranmsfer
 way. The thin film of go ois only to eliminate the smal lAir cavities
 whics conduct very poorly.
I suppose in Theory a Lapped surface is best. But that is not practical
on the CPU itslef becuase it is so easy to damage a possabibly
expensive CPU..
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