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| subject: | Adhesives for Testing |
JH> JH>adhesive out around ther edges of the overall chip. JH> TW> For what purpose? I fail to see the need at all. JH>For the purpose I stated in my original posting - - to be able to JH>remove a cpu+heatsink and fan combo from a test mainboard and move it JH>to another mainboard to be tested, without having to rework the cpu to JH>hs&f thermal compound interface.. Sorry that point got lost i nthe Discussion. But most Heatsinks hang over and you cannot use the ZIF socket lever don't they? --- þ SLMR 2.1a þ This note from El Cajon California USA* Origin: Try Our Web Based QWK: DOCSPLACE.ORG (1:123/140) SEEN-BY: 633/267 270 @PATH: 123/140 500 106/2000 633/267 |
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