Hello Jim ! 

 JH> I intend to use heatsink compound on the die, and put the gobs of
 JH> adhesive out around the edges of the overall chip.

        Neat trick that would be. If not for the long curring time,
  RTV would do better and remain supple. (R)oom (T)emperature
  (V)ulcanizing better know as silicone, in tubes.


 No thanks to IBM on recovering this Thinkpad.
  Thanks to all on the echo.
 
    
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