-> -=> on 03-22-05 20:53, JAY EMRIE wrote to JIM HOLSONBACK <=-

->  JE> Jim, I'm no expert is this area, but it seems to me that the adhesive
->  JE> you talk about would NOT provide the necessary heat conduction between
->  JE> the CPU and the heat sink - thus likely to damage the CPU.

-> I think so too.  I was going to put heatsink compound on the die, and
-> use the adhesive out at the periphery of the chip.

you can do this of course but have you considered the thermal effects
of the CPU on the adhesive's properties?
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