23 Mar 2005, 11:08, JIM HOLSONBACK (1:123/140), wrote to JEAN PARROT:

Hi JIM.

 JP>>         Hee ! Try it in the microwave first. You will find that 
 JP>> it  gets hard as rock. Then, I do not think that its BTU transfer 
 JP>> would  fill the need. It looks more like an insulator to me.

 JH> I intend to use heatsink compound on the die, and put the gobs of
 JH> adhesive out around ther edges of the overall chip.
 JH> - - -  JimH.

That would be the only way!  On the P-4s, the heatsink overlaps the CPU so
much that there is no way to release the CPU socket locking handle to
remove the CPU/Heatsink as a unit  :-((

My best guess for making something 'portable' would be to use some of that
automotive High Temp Silicone around the edge if you can get it to set
before it drips or runs.  At least it should be able to withstand the fin
temperatures, and it is pretty easy to cut loose with a razor blade when no
longer needed.  

A 'thicker wall' of that Silicone would reduce the 'stretch factor' when
removing and handling the 'assembly' to reduce the chance of breaking the
actual heat sink compound loose. 


     Good luck...  M.

--- Msged/386 TE 06 (pre)