24 Mar 2005, 09:04, TOM WALKER (1:123/140), wrote to JIM HOLSONBACK:

Hi TOM.

 JH>>I intend to use heatsink compound on the die, and put the gobs of
 JH>>adhesive out around ther edges of the overall chip.

 TW> For what purpose? I fail to see the need at all.

Jim is making a "CPU Assembly" where he can plug the
CPU/Heatsink-Fan into many different MBs for testing, _without_ having to
mess with the heatsink thermal compound every time he moves it to another
MB.


     Good luck...  M.

--- Msged/386 TE 06 (pre)