JH>Hello to ALL.

JH>I am about to start into some testing of a number of Athlon type
JH>mainboards.  I have an older Duron 900 or so chip for my test cpu, and a
JH>suitable heatsink/fan combo for that. What I want to avoid is having to
JH>disassemble the cpu/heatsink combo at each testing, and worry about
JH>reapplication of heatsink compound.

JH>I'm thinking about some sort of temporary adhesive between the cpu chip
JH>and the heatsink/fan, so that they can remain together between mainboard
JH>testings.

JH>In recent mailings to me of credit card renewals, the cards are mailed
JH>attached by some sort of a gob of goo adhesive to a stiff paper
JH>substrate. I was thinking that this sort of temporary adhesive might
JH>suit my testing purposes for mating of a test cpu to a test HS&F, for
JH>swapping around.

JH>Any advice for this situation  will be appreciated.  Thanks in advance.

Jim, I'm no expert is this area, but it seems to me that the adhesive
you talk about would NOT provide the necessary heat conduction between
the CPU and the heat sink - thus likely to damage the CPU.

Jay
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 þ OLXWin 1.00a þ I feel young, but my body doesn't agree.