Hello, Tom.

-=> on 04-03-05 07:42, TOM WALKER wrote to JIM HOLSONBACK <=-

 JH>Thanks for responding again, but you have never seemed to understand
 JH>that I did not want to use anything other than standard heatsink
 JH>compound between the HS&F and the die on the chip, and some alternate
 JH>adhesive around the periphery,  so I could pick up the cpu chip and HS&F
 JH>combo, and move them to another mainboard for testing.

 TW>  I KNOW that, IF you will check the message you will see that I was
 TW>  countering MR's contention that the sticky snot used to fasten Credit
 TW>  Cards the their forwarding letter was NOT in any way a "Heat Sink"
 TW>  compound and is reality a "Heat Insulator" and should
NEVER use used
 TW> on a CPU/Heat Sink interface situation.

Oops! You are correct.  Sorry I vented a bit - I was mainly frustrated
at myself for not making my original post more clear.

- - -  JimH.
 
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