JH> MR>I don't recall if it was you who was asking about swapping out cpu's
JH> MR>on heatsinks and looking for a quick heatsink compound to use. Mention
JH> MR>was made of the jelly-like goop used to stick credit cards on a
JH> MR>carboard sheet as a possible compound but no one knew what it was
JH> MR>called. Well, I saw something about it today on a craft show and the
JH> MR>stuff is called a "glue dot" and it comes on a
rolled up ribbon. It is
JH> MR>available at art & craft or perhaps office supplies too.

JH> TW>  BUT it is a HEAT INSULATOR and not a Heat Conductor and would make the
JH> TW>  CPU run HOTTER. NOt exacticaly a good thing. NOTHING, jsut whatever
JH> TW>  physical contact woudl be better for short term testing.

JH>Thanks for responding again, but you have never seemed to understand
JH>that I did not want to use anything other than standard heatsink
JH>compound between the HS&F and the die on the chip, and some alternate
JH>adhesive around the periphery,  so I could pick up the cpu chip and HS&F
JH>combo, and move them to another mainboard for testing.

 I KNOW that, IF you will check the message you will see that I was
 countering MR's contention that the sticky snot used to fasten Credit
 Cards the their forwarding letter was NOT in any way a "Heat Sink"
 compound and is reality a "Heat Insulator" and should NEVER use used on
 a CPU/Heat Sink interface situation.
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 þ SLMR 2.1a þ This note from El Cajon California USA