Hello, Tom.
-=> on 04-02-05 06:46, TOM WALKER wrote to MIKE ROSS <=-

 MR>I don't recall if it was you who was asking about swapping out cpu's
 MR>on heatsinks and looking for a quick heatsink compound to use. Mention
 MR>was made of the jelly-like goop used to stick credit cards on a
 MR>carboard sheet as a possible compound but no one knew what it was
 MR>called. Well, I saw something about it today on a craft show and the
 MR>stuff is called a "glue dot" and it comes on a rolled up
ribbon. It is
 MR>available at art & craft or perhaps office supplies too.

 TW>  BUT it is a HEAT INSULATOR and not a Heat Conductor and would make the
 TW>  CPU run HOTTER. NOt exacticaly a good thing. NOTHING, jsut whatever
 TW>  physical contact woudl be better for short term testing.

Thanks for responding again, but you have never seemed to understand
that I did not want to use anything other than standard heatsink
compound between the HS&F and the die on the chip, and some alternate
adhesive around the periphery,  so I could pick up the cpu chip and HS&F
combo, and move them to another mainboard for testing.

When I finally find the el-cheapo HS&F's I have here, I plan to take a
hacksaw to them, cut off the overhang over the cpu release lever,
relocate their fans, and use _some_ sort of adhesive between the
perimiter of the chip and the heatsink, so be able to move chip and HS&F
combo from mainboard to mainboard, for testing.

- - -  JimH.

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