| TIP: Click on subject to list as thread! | ANSI |
| echo: | |
|---|---|
| to: | |
| from: | |
| date: | |
| subject: | ram parts |
MIKE ROSS wrote in a message to Thurston Ackerman:
TW> Actualy for hte medical equipment they recomended leaving the
TW> Contacts Dry.
MR> Many contact cleaners tend to leave a residue which improves the
MR> conductivity of the metal contact but I've found in some high
MR> impedance circuits that this residue causes current leakages. Not
MR> so good for fet inputs for example and I always cleaned these off
MR> with 99% iso...
This is a *real* important point, when it comes to contact cleaners.
There are basically two kinds out there, those that leave a residue
("lubricating", etc.) and those that don't. I've always tended
to favor those that don't.
TW> The Chips had a tendenacy to work their way out of the sockets
TW> anyhow with the Heatup/CoolDown cycles. In fact Reseating All
TW> chips was part of the Quarterly PM routine.
MR> I noticed some brands of sockets were better with chip creep than
MR> others. Many early cheap XT clones for example always needed the
MR> dram pushed down every few months as their chips kept climbing out
MR> of their sockets relentlessly.
I'd guess that depends on the design of the contact _and_ on what metals
were being used, both in the chip legs and in the socket material...
---
* Origin: TANSTAAFL BBS 717-838-8539 (1:270/615)SEEN-BY: 10/345 106/1 116/35 128/187 150/115 220 167/133 226/600 229/1000 SEEN-BY: 229/2000 3000 249/116 266/12 270/615 280/5003 379/1 1200 633/267 SEEN-BY: 633/270 712/848 2404/201 3800/1 @PATH: 270/615 150/220 379/1 633/267 |
|
| SOURCE: echomail via fidonet.ozzmosis.com | |
Email questions or comments to sysop@ipingthereforeiam.com
All parts of this website painstakingly hand-crafted in the U.S.A.!
IPTIA BBS/MUD/Terminal/Game Server List, © 2025 IPTIA Consulting™.