a2aviator{at}gmail.com wrote:
> Yes, they are very similar in construction, tis why I mentioned
> applied heat to the lead itself. With one exception, use some method
> of solder resist on the lower half of the exposed lead so that it does
> not get tinned if possible. Because of course the solder will want to
> flow towards the heat source.

Since I'm planning to run the chip solely in a ZIF socket, I don't think it 
makes any difference whether or not I end up tinning the lower portion of the 
leads.  I can clean off any significant buildup with a bit of solderwick.

> Thats if you don't expose the joint itself, you can then just go in
> with a 1/64" tip and hit it right on the spot.

That will definitely be a last resort.  I'm hoping to avoid grinding into the 
epoxy.
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