(Continued from previous message)

circuitry is what to do with heat dissipation.  One attempt to deal
with this would be to improve the thermoelectrical
properties of the intrinsic circuitry material and use the material
to make coolers for on-site chilling. The conventional typical
thermoelectric materials, such as Bi2Te3,  do not fit easily
with the common integrated circuit semiconductors----Si, GaAs, and
InP---because of a mismatch of the atomic spacing. Now, a group of
scientists at the University of Massachusetts at Amherst, with a
colleague at the Hong Kong University of Science and Technology, has
tried to
solve the problem by making coolers using the GaAs-based material
itself.  With this approach they have been able to bring about
cooling of 0.8 degrees at a temperature of 25 C and 2 degrees at a
temperature of 100 C. (Zhang et al., Applied Physics Letters, 14
July 2003; contact Jizhi Zhang, 413-545-0712,
jizhang{at}ecs.umass..edu; text at www.aip.org/physnews/select )

***********
PHYSICS NEWS UPDATE is a digest of physics news items arising
from physics meetings, physics journals, newspapers and
magazines, and other news sources.  It is provided free of charge
as a way of broadly disseminating information about physics and
physicists. For that reason, you are free to post it, if you like,
where others can read it, providing only that you credit AIP.
Physics News Update appears approximately once a week.

AUTO-SUBSCRIPTION OR DELETION: By using the expression
"subscribe physnews" in your e-mail message, you
will have automatically added the address from which your
message was sent to the distribution list for Physics News Update.
If you use the "signoff physnews" expression in your e-mail message,
the address in your message header will be deleted from the
distribution list.  Please send your message to:
listserv{at}listserv.aip.org
(Leave the "Subject:" line blank.)


---
 þ OLXWin 1.00b þ Message contents may settle during shipment.